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| Features * High-density, High-performance, Electrically-erasable Complex Programmable Logic Device - 3.0V to 3.6V Operating Range - 128 Macrocells - 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell - 84, 100, 160 Pins - 15 ns Maximum Pin-to-pin Delay - Registered Operation up to 77 MHz - Enhanced Routing Resources Flexible Logic Macrocell - D/T/Latch Configurable Flip-flops - Global and Individual Register Control Signals - Global and Individual Output Enable - Programmable Output Slew Rate - Programmable Output Open Collector Option - Maximum Logic Utilization by Burying a Register within a COM Output Advanced Power Management Features - Automatic 5 A Standby for "L" Version - Pin-controlled 100 A Standby Mode - Programmable Pin-keeper Inputs and I/Os - Reduced-power Feature per Macrocell Available in Commercial and Industrial Temperature Ranges Available in 84-lead PLCC and 100-lead PQFP and TQFP and 160-lead PQFP Packages Advanced EE Technology - 100% Tested - Completely Reprogrammable - 10,000 Program/Erase Cycles - 20 Year Data Retention - 2000V ESD Protection - 200 mA Latch-up Immunity JTAG Boundary-scan Testing to IEEE Std. 1149.1-1990 and 1149.1a-1993 Supported Fast In-System Programmability (ISP) via JTAG PCI-compliant Security Fuse Feature * Highperformance EE PLD ATF1508ASV ATF1508ASVL * * * * * * * * Enhanced Features * * * * * * * * * * * Improved Connectivity (Additional Feedback Routing, Alternate Input Routing) Output Enable Product Terms Transparent-latch Mode Combinatorial Output with Registered Feedback within Any Macrocell Three Global Clock Pins ITD (Input Transition Detection) Circuits on Global Clocks, Inputs and I/O Fast Registered Input from Product Term Programmable "Pin-keeper" Option VCC Power-up Reset Option Pull-up Option on JTAG Pins TMS and TDI Advanced Power Management Features - Edge-controlled Power-down "L" - Individual Macrocell Power Option - Disable ITD on Global Clocks, Inputs and I/O for "Z" Parts Rev. 1408E-09/00 1 84-lead PLCC Top View I/O I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O 100-lead TQFP Top View I/O I/O I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O/PD2 I/O GND I/O I/O I/O I/O I/O VCCIO 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 I/O/PD1 VCCIO I/O/TDI I/O I/O I/O I/O GND I/O I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O I/O I/O GND 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 I/O I/O GND I/O/TDO I/O I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O I/O I/O 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 26 27 28 29 30 31 33 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 I/O/PD1 I/O VCCIO I/O/TDI I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O I/O I/O I/O I/O 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 I/O GND I/O/TDO I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCIO 100-lead PQFP Top View I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 I/O I/O/PD2 I/O N/C N/C N/C N/C I/O I/O I/O I/O I/O GND I/O I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O I/O VCCIO I/O I/O I/O I/O I/O N/C N/C N/C N/C I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O/PD2 I/O GND I/O I/O I/O I/O I/O I/O I/O 160-lead PQFP Top View I/O I/O I/O/PD1 I/O VCCIO I/O/TDI I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O I/O I/O I/O I/O GND I/O I/O 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 I/O I/O I/O I/O GND I/O/TDO I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O/PD2 I/O GND I/O I/O I/O I/O I/O N/C N/C N/C N/C N/C N/C N/C VCCIO I/O/TDI I/O I/O I/O I/O I/O I/O I/O GND I/O I/O I/O I/O I/O/TMS I/O I/O I/O VCCIO I/O I/O I/O I/O I/O I/O I/O N/C N/C N/C N/C N/C N/C N/C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 N/C N/C N/C N/C N/C N/C N/C GND I/O/TDO I/O I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O I/O I/O/TCK I/O I/O I/O GND I/O I/O I/O I/O I/O I/O I/O N/C N/C N/C N/C N/C N/C N/C 2 ATF1508ASV(L) I/O GND I/O N/C N/C N/C N/C I/O I/O I/O I/O I/O I/O I/O VCCIO I/O I/O I/O I/O GND VCCINT I/O I/O/PD1 I/O I/O GND I/O I/O I/O I/O I/O I/O I/O N/C N/C N/C N/C I/O VCCIO I/O ATF1508ASV(L) Block Diagram 6 to 12 3 Description The ATF1508ASV(L) is a high-performance, high-density complex programmable logic device (CPLD) that utilizes Atmel's proven electrically-erasable technology. With 128 logic macrocells and up to 100 inputs, it easily integrates logic from several TTL, SSI, MSI, LSI and classic PLDs. The ATF1508ASV(L)'s enhanced routing switch matrices increase usable gate count and increase odds of successful pin-locked design modifications. The ATF1508ASV(L) has up to 96 bi-directional I/O pins and four dedicated input pins, depending on the type of device package selected. Each dedicated pin can also serve as a global control signal, register clock, register reset or output enable. Each of these control signals can be selected for use individually within each macrocell. Each of the 128 macrocells generates a buried feedback that goes to the global bus. Each input and I/O pin also feeds into the global bus. The switch matrix in each logic block then selects 40 individual signals from the global bus. Each macrocell also generates a foldback logic term that goes to a regional bus. Cascade logic between macrocells in the ATF1508ASV(L) allows fast, efficient generation of complex logic functions. The ATF1508ASV(L) contains eight such logic chains, each capable of creating sum term logic with a fan-in of up to 40 product terms. The ATF1508ASV(L) macrocell, shown in Figure 1, is flexible enough to support highly-complex logic functions operating at high-speed. The macrocell consists of five sections: product terms and product term select multiplexer, OR/XOR/CASCADE logic, a flip-flop, output select and enable, and logic array inputs. Unused macrocells are automatically disabled by the compiler to decrease power consumption. A security fuse, when programmed, protects the contents of the ATF1508ASV(L). Two bytes (16 bits) of User Signature are accessible to the user for purposes such as storing project name, part number, revision or date. The User Signature is accessible regardless of the state of the security fuse. The ATF1508ASV(L) device is an in-system programmable (ISP) device. It uses the industry-standard 4-pin JTAG interface (IEEE Std. 1149.1), and is fully-compliant with JTAG's Boundary-scan Description Language (BSDL). ISP allows the device to be programmed without removing it from the printed circuit board. In addition to simplifying the manufacturing flow, ISP also allows design modifications to be made in the field via software. Product Terms and Select Mux Each ATF1508ASV(L) macrocell has five product terms. Each product term receives as its inputs all signals from both the global bus and regional bus. The product term select multiplexer (PTMUX) allocates the five product terms as needed to the macrocell logic gates and control signals. The PTMUX programming is determined by the design compiler, which selects the optimum macrocell configuration. OR/XOR/CASCADE Logic The ATF1508ASV(L)'s logic structure is designed to efficiently support all types of logic. Within a single macrocell, all the product terms can be routed to the OR gate, creating a 5-input AND/OR sum term. With the addition of the CASIN from neighboring macrocells, this can be expanded to as many as 40 product terms with little additional delay. The macrocell's XOR gate allows efficient implementation of compare and arithmetic functions. One input to the XOR comes from the OR sum term. The other XOR input can be a product term or a fixed high- or low-level. For combinatorial outputs, the fixed level input allows polarity selection. For registered functions, the fixed levels allow DeMorgan minimization of product terms. The XOR gate is also used to emulate T- and JK-type flip-flops. Flip-flop The ATF1508ASV(L)'s flip-flop has very flexible data and control functions. The data input can come from either the XOR gate, from a separate product term or directly from the I/O pin. Selecting the separate product term allows creation of a buried registered feedback within a combinatorial output macrocell. (This feature is automatically implemented by the fitter software). In addition to D, T, JK and SR operation, the flip-flop can also be configured as a flowthrough latch. In this mode, data passes through when the clock is high and is latched when the clock is low. The clock itself can either be the Global CLK Signal (GCK) or an individual product term. The flip-flop changes state on the clock's rising edge. When the GCK signal is used as the clock, one of the macrocell product terms can be selected as a clock enable. When the clock enable function is active and the enable signal (product term) is low, all clock edges are ignored. The flip-flop's asynchronous reset signal (AR) can be either the Global Clear (GCLEAR), a product term, or always off. AR can also be a logic OR of GCLEAR with a product term. The asynchronous preset (AP) can be a product term or always off. 4 ATF1508ASV(L) ATF1508ASV(L) Figure 1. ATF1508ASV(L) Macrocell Output Select and Enable The ATF1508ASV(L) macrocell output can be selected as registered or combinatorial. The buried feedback signal can be either combinatorial or registered signal regardless of whether the output is combinatorial or registered. The output enable multiplexer (MOE) controls the output enable signals. Any buffer can be permanently enabled for simple output operation. Buffers can also be permanently disabled to allow use of the pin as an input. In this configuration. all the macrocell resources are still available, including the buried feedback, expander and CASCADE logic. The output enable for each macrocell can be selected as one of the global OUTPUT enable signals. The device has six global OE signals. Global Bus/Switch Matrix The global bus contains all input and I/O pin signals as well as the buried feedback signal from all 128 macrocells. The switch matrix in each logic block receives as its inputs all signals from the global bus. Under software control, up to 40 of these signals can be selected as inputs to the logic block. Foldback Bus Each macrocell also generates a foldback product term. This signal goes to the regional bus and is available to 16 macrocells. The foldback is an inverse polarity of one of the macrocell's product terms. The 16 foldback terms in each region allow generation of high fan-in sum terms (up to 21 product terms) with little additional delay. Open-collector Output Option This option enables the device output to provide control signals such as an interrupt that can be asserted by any of the several devices. 5 Programmable Pin-keeper Option for Inputs and I/Os The ATF1508ASV(L) offers the option of programming all input and I/O pins so that "pin-keeper" circuits can be utilized. When any pin is driven high or low and then subsequently left floating, it will stay at that previous high- or lowlevel. This circuitry prevents unused input and I/O lines from floating to intermediate voltage levels, which causes unnecessary power consumption and system noise. The keeper circuits eliminate the need for external pull-up resistors and eliminate their DC power consumption. I/O Diagram Input Diagram Speed/Power Management The ATF1508ASV(L) has several built-in speed and power management features. The ATF1508ASV(L) contains circuitry that automatically puts the device into a low-power standby mode when no logic transitions are occurring. This not only reduces power consumption during inactive periods, but also provides proportional power-savings for most applications running at system speeds below 5 MHz. To further reduce power, each ATF1508ASV(L) macrocell has a reduced-power bit feature. This feature allows individual macrocells to be configured for maximum powersavings. This feature may be selected as a design option. All ATF1508 also have an optional power-down mode. In this mode, current drops to below 10 mA. When the powerdown option is selected, either PD1 or PD2 pins (or both) can be used to power down the part. The power-down option is selected in the design source file. When enabled, the device goes into power-down when either PD1 or PD2 is high. In the power-down mode, all internal logic signals are latched and held, as are any enabled outputs. All pin transitions are ignored until the PD pin is brought low. When the power-down feature is enabled, the PD1 or PD2 pin cannot be used as a logic input or output. However, the pin's macrocell may still be used to generate buried foldback and cascade logic signals. All power-down AC characteristic parameters are computed from external input or I/O pins, with reduced-power bit turned on. For macrocells in reduced-power mode (reduced-power bit turned on), the reduced-power adder, tRPA, must be added to the AC parameters, which include the data paths tLAD, tLAC, tIC, tACL, tACH and tSEXP. Each output also has individual slew rate control. This may be used to reduce system noise by slowing down outputs that do not need to operate at maximum speed. Outputs default to slow switching, and may be specified as fast switching in the design file. 6 ATF1508ASV(L) ATF1508ASV(L) Design Software Support ATF1508ASV(L) designs are supported by several thirdparty tools. Automated fitters allow logic synthesis using a variety of high-level description languages and formats. fuse verify is inhibited. However, User Signature and device ID remains accessible. Programming ATF1508ASV(L) devices are in-system programmable (ISP) devices utilizing the 4-pin JTAG protocol. This capability eliminates package handling normally required for programming and facilitates rapid design iterations and field changes. Atmel provides ISP hardware and software to allow programming of the ATF1508ASV(L) via the PC. ISP is performed by using either a download cable, a comparable board tester or a simple microprocessor interface. To allow ISP programming support by the Automated Test Equipment (ATE) vendors, Serial Vector Format (SVF) files can be created by the Atmel ISP software. Conversion to other ATE tester format beside SVF is also possible ATF1508ASV(L) devices can also be programmed using standard third-party programmers. With third-party programmer, the JTAG ISP port can be disabled thereby allowing four additional I/O pins to be used for logic. Contact your local Atmel representatives or Atmel PLD applications for details. Power-up Reset The ATF1508ASV is designed with a power-up reset, a feature critical for state machine initialization. At a point delayed slightly from VCC crossing VRST, all registers will be initialized, and the state of each output will depend on the polarity of its buffer. However, due to the asynchronous nature of reset and uncertainty of how VCC actually rises in the system, the following conditions are required: 1. The VCC rise must be monotonic, 2. After reset occurs, all input and feedback setup times must be met before driving the clock pin high, and, 3. The clock must remain stable during TD. The ATF1508ASV has two options for the hysteresis about the reset level, VRST, Small and Large. To ensure a robust operating environment in applications where the device is operated near 3.0V, Atmel recommends that during the fitting process users configure the device with the Power-up Reset hysteresis set to Large. For conversions, Atmel POF2JED users should include the flag "-power_reset" on the command line after "filename.POF". To allow the registers to be properly reinitialized with the Large hysteresis option selected, the following condition is added: 4. If VCC falls below 2.0V, it must shut off completely before the device is turned on again. When the Large hysteresis option is active, ICC is reduced by several hundred microamps as well. ISP Programming Protection The ATF1508ASV(L) has a special feature that locks the device and prevents the inputs and I/O from driving if the programming process is interrupted for any reason. The inputs and I/O default to high-Z state during such a condition. In addition the pin-keeper option preserves the former state during device programming. All ATF1508ASV(L) devices are initially shipped in the erased state thereby making them ready to use for ISP. Note: For more information refer to the "Designing for In-System Programmability with Atmel CPLDs" application note. Security Fuse Usage A single fuse is provided to prevent unauthorized copying of the ATF1508ASV(L) fuse patterns. Once programmed, 7 DC and AC Operating Conditions Commercial Operating Temperature (Ambient) VCC (3.3V) Power Supply 0C - 70C 3.0V - 3.6V Industrial -40C - 85C 3.0V - 3.6V DC Characteristics Symbol IIL IIH IOZ Parameter Input or I/O Low Leakage Current Input or I/O High Leakage Current Tri-State Output Off-State Current VO = VCC or GND Com. Std Mode ICC1 Power Supply Current, Standby VCC = Max VIN = 0, VCC "L" Mode Ind. ICC2 ICC3(2) VIL VIH Power Supply Current, Power-down Mode Reduced-power Mode Supply Current, Standby Input Low Voltage Input High Voltage Output Low Voltage (TTL) VOL Output Low Voltage (CMOS) Output High Voltage - 3.3V (TTL) VOH Output High Voltage - 3.3V (CMOS) VIN = VIH or VIL VCC = Min, IOL = 0.1 mA VIN = VIH or VIL VCC = Min, IOH = -2.0 mA VIN = VIH or VIL VCCIO = Min, IOH = -0.1 mA VIN = VIH or VIL VCC = Min, IOL = 8 mA Com. Ind. Com. Ind. 2.4 VCCIO - 0.2 VCC = Max VIN = 0, VCC VCC = Max VIN = 0, VCC "PD" Mode Com. Std Mode Ind. -0.3 1.7 80 0.8 VCCIO + 0.3 0.45 0.45 0.2 0.2 mA V V V V V V V V 5 0.1 60 5 A mA mA Ind. Com. 135 5 mA A -40 115 Condition VIN = VCC Min Typ -2 2 Max -10 10 40 Units A A A mA Notes: 1. Not more than one output at a time should be shorted. Duration of short circuit test should not exceed 30 sec. 2. ICC3 refers to the current in the reduced-power mode when macrocell reduced-power is turned ON. Pin Capacitance Typ CIN CI/O Max 8 8 Units pF pF Conditions VIN = 0V; f = 1.0 MHz VOUT = 0V; f = 1.0 MHz Note: Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. The OGI pin (high-voltage pin during programming) has a maximum capacitance of 12 pF. 8 ATF1508ASV(L) ATF1508ASV(L) Absolute Maximum Ratings* Temperature Under Bias.................................. -40C to +85C Storage Temperature ..................................... -65C to +150C Voltage on Any Pin with Respect to Ground .........................................-2.0V to +7.0V(1) Voltage on Input Pins with Respect to Ground During Programming.....................................-2.0V to +14.0V(1) Note: Programming Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) 1. *NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V DC, which may overshoot to 7.0V for pulses of less than 20 ns. Timing Model U 9 AC Characteristics(1) -15 Symbol tPD1 tPD2 tSU tH tFSU tFH tCOP tCH tCL tASU tAH tACOP tACH tACL tCNT fCNT tACNT fACNT fMAX tIN tIO tFIN tSEXP tPEXP tLAD tLAC tIOE tOD1 tOD2 tOD3 tZX1 Parameter Input or Feedback to Non-registered Output I/O Input or Feedback to Non-registered Feedback Global Clock Setup Time Global Clock Hold Time Global Clock Setup Time of Fast Input Global Clock Hold Time of Fast Input Global Clock to Output Delay Global Clock High Time Global Clock Low Time Array Clock Setup Time Array Clock Hold Time Array Clock Output Delay Array Clock High Time Array Clock Low Time Minimum Clock Global Period Maximum Internal Global Clock Frequency Minimum Array Clock Period Maximum Internal Array Clock Frequency Maximum Clock Frequency Input Pad and Buffer Delay I/O Input Pad and Buffer Delay Fast Input Delay Foldback Term Delay Cascade Logic Delay Logic Array Delay Logic Control Delay Internal Output Enable Delay Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 5V; CL = 35 pF) Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF) Output Buffer and Pad Delay (Slow slew rate = ON; VCCIO = 5V or 3.3V; CL = 35 pF) Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 5.0V; CL = 35 pF) 76.9 100 2 2 2 8 1 6 3.5 3 3 3 5 7 76.9 13 58.8 83.3 2.5 2.5 2 10 1 8 4.5 3 4 4 6 9 6 6 13 66 17 5 5 5 4 15 8 8 17 Min 3 3 11 0 3 1.0 9 6 6 7 4 18.5 Max 15 12 13.5 0 3 2.0 12 Min -20 Max 20 16 Units ns ns ns ns ns MHz ns ns ns ns ns ns ns ns ns MHz ns MHz MHz ns ns ns ns ns ns ns ns ns ns ns 10 ATF1508ASV(L) ATF1508ASV(L) AC Characteristics(1) (Continued) -15 Symbol tZX2 tZX3 tXZ tSU tH tFSU tFH tRD tCOMB tIC tEN tGLOB tPRE tCLR tUIM tRPA Notes: Parameter Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF) Output Buffer Enable Delay (Slow slew rate = ON; VCCIO = 5.0V/3.3V; CL = 35 pF) Output Buffer Disable Delay (CL = 5 pF) Register Setup Time Register Hold Time Register Setup Time of Fast Input Register Hold Time of Fast Input Register Delay Combinatorial Delay Array Clock Delay Register Enable Time Global Control Delay Register Preset Time Register Clear Time Switch Matrix Delay Reduced-Power Adder (2) -20 Max 7 10 6 Min Max 9 11 7 6 5 2 2 2 2 6 6 2 4 4 2 10 2.5 3 7 7 3 5 5 2.5 13 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Min 5 4 2 2 1. See ordering information for valid part numbers. 2. The tRPA parameter must be added to the tLAD, tLAC,tTIC, tACL, and tSEXP parameters for macrocells running in the reducedpower mode. Input Test Waveforms and Measurement Levels Output AC Test Loads 3.0V 703 8060 tR, tF = 1.5 ns typical 11 Power-down Mode The ATF1508ASV(L) includes two pins for optional pincontrolled power-down feature. When this mode is enabled, the PD pin acts as the power-down pin. When the PD1 and PD2 pin is high, the device supply current is reduced to less than 5 mA. During power-down, all output data and internal logic states are latched and held. Therefore, all registered and combinatorial output data remain valid. Any outputs that were in a high-Z state at the onset will remain at high-Z. During power-down, all input signals except the power-down pin are blocked. Input and I/O hold latches remain active to ensure that pins do not float to indeterminate levels, further reducing system power. The power-down pin feature is enabled in the logic design file. Designs using either power-down pin may not use the PD pin logic array input. However, buried logic resources in this macrocell may still be used. Power Down AC Characteristics(1)(2) -15 Symbol tIVDH tGVDH tCVDH tDHIX tDHGX tDHCX tDLIV tDLGV tDLCV tDLOV Notes: Parameter Valid I, I/O before PD High Valid OE (2) -20 Max Min 20 20 20 25 25 25 1 1 1 1 30 30 30 1 1 1 1 Max Units ns ns ns ns ns ns s s s s Min 15 15 15 before PD High (2) Valid Clock before PD High I, I/O Don't Care after PD High OE(2) Don't Care after PD High Clock (2) Don't Care after PD High PD Low to Valid I, I/O PD Low to Valid OE (Pin or Term) PD Low to Valid Clock (Pin or Term) PD Low to Valid Output 1. For slow slew outputs, add tSSO. 2. Pin or product term. 12 ATF1508ASV(L) ATF1508ASV(L) JTAG-BST Overview The JTAG-BST (JTAG boundary-scan testing) is controlled by the Test Access Port (TAP) controller in the ATF1508ASV(L). The boundary-scan technique involves the inclusion of a shift-register stage (contained in a boundary-scan cell) adjacent to each component so that signals at component boundaries can be controlled and observed using scan testing principles. Each input pin and I/O pin has its own Boundary-scan Cell (BSC) in order to support boundary-scan testing. The ATF1508ASV(L) does not currently include a Test Reset (TRST) input pin because the TAP controller is automatically reset at power-up. The six JTAG-BST modes supported include: SAMPLE/PRELOAD, EXTEST, BYPASS and IDCODE. BST on the ATF1508ASV(L) is implemented using the Boundary-scan Definition Language (BSDL) described in the JTAG specification (IEEE Standard 1149.1). Any third-party tool that supports the BSDL format can be used to perform BST on the ATF1508ASV(L). The ATF1508ASV(L) also has the option of using four JTAG-standard I/O pins for in-system programming (ISP). The ATF1508ASV(L) is programmable through the four JTAG pins using programming-compatible with the IEEE JTAG Standard 1149.1. Programming is performed by using 5V TTL-level programming signals from the JTAG ISP interface. The JTAG feature is a programmable option. If JTAG (BST or ISP) is not needed, then the four JTAG control pins are available as I/O pins. BSCs, one for input or I/O pin, and one for the macrocells. The BSCs in the device are chained together through the (BST) capture registers. Input to the capture register chain is fed in from the TDI pin while the output is directed to the TDO pin. Capture registers are used to capture active device data signals, to shift data in and out of the device and to load data into the update registers. Control signals are generated internally by the JTAG TAP controller. The BSC configuration for the input and I/O pins and macrocells are shown below. BSC Configuration Pins and Macrocells (Except JTAG TAP Pins) Note: JTAG Boundary-scan Cell (BSC) Testing The ATF1508ASV(L) contains up to 96 I/O pins and four input pins, depending on the device type and package type selected. Each input pin and I/O pin has its own boundaryscan cell (BSC) in order to support boundary-scan testing as described in detail by IEEE Standard 1149.1. A typical BSC consists of three capture registers or scan registers and up to two update registers. There are two types of The ATF1508ASV(L) has pull-up option on TMS and TDI pins. This feature is selected as a design option. Boundary-scan Definition Language (BSDL) Models for the ATF1508 These are now available in all package types via the Atmel web site. These models can be used for Boundary-scan Test Operation in the ATF1508ASV(L) and have been scheduled to conform to the IEEE 1149.1 standard. 13 BSC Configuration for Macrocell Pin BSC TDO Pin 0 1 DQ Capture DR TDI Clock Shift TDO OEJ 0 0 1 1 DQ DQ OUTJ 0 0 1 1 DQ DQ Pin Capture DR TDI Shift Update DR Mode Clock Macrocell BSC 14 ATF1508ASV(L) ATF1508ASV(L) ATF1508ASV(L) Dedicated Pinouts Dedicated Pin INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 I/O/GCLK3 I/O/PD (1, 2) I/O/TDI(JTAG) I/O/TMS(JTAG) I/O/TCK(JTAG) I/O/TDO(JTAG) GND VCC 84-lead J-lead 2 1 84 83 81 12,45 14 23 62 71 7,19,32,42, 47,59,72,82 3,13,26,38, 43,53,66,78 100-lead PQFP 92 91 90 89 87 3,43 6 17 64 75 13,28,40,45, 61,76,88,97 5,20,36,41, 53,68,84,93 100-lead TQFP 90 89 88 87 85 1,41 4 15 62 73 11,26,38,43, 59,74,86,95 3,18,34,39, 51,66,82,91 160-lead PQFP 142 141 140 139 137 63,159 9 22 99 112 17,42,60,66,95, 113,138,148 8,26,55,61,79,104,133,143 1,2,3,4,5,6,7,34,35,36, 37,38,39,40,44,45,46, 47,74,75,76,77,81,82, 83,84,85,86,87,114, 115,116,117,118,119, 120,124,125,126,127, 154,155,156,157 100 96 N/C - - - # of SIGNAL PINS # USER I/O PINS 68 64 84 80 84 80 OE (1, 2) GCLR GCLK (1, 2, 3) PD (1, 2) TDI, TMS, TCK, TDO GND VCC Global OE pins Global Clear pin Global Clock pins Power-down pins JTAG pins used for boundary-scan testing or in-system programming Ground pins VCC pins for the device 15 ATF1508ASV(L) I/O Pinouts MC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 65 66 PLB A A A/ PD1 A A A A A A A A A A A A A B B B B B B B B B B B B B B B B/ TDI E E 84-lead J-lead 12 11 10 9 8 6 5 4 22 21 20 18 17 16 15 14 44 100-lead PQFP 4 3 2 1 100 99 98 96 95 94 16 15 14 12 11 10 9 8 7 6 42 100-lead TQFP 2 1 100 99 98 97 96 94 93 92 14 13 12 10 9 8 7 6 5 4 40 160-lead PQFP 160 159 158 153 152 151 150 149 147 146 145 144 21 20 19 18 16 15 14 13 12 11 10 9 62 MC 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 97 98 PLB C C C C C C C C C C C C C C C C/ TMS D D D D D D D D D D D D D D D D G G 84-lead J-lead 31 30 29 28 27 25 24 23 41 40 39 37 36 35 34 33 63 100-lead PQFP 27 26 25 24 23 22 21 19 18 17 39 38 37 35 34 33 32 31 30 29 65 100-lead TQFP 25 24 23 22 21 20 19 17 16 15 37 36 35 33 32 31 30 29 28 27 63 160-lead PQFP 41 33 32 31 30 29 28 27 25 24 23 22 59 58 57 56 54 53 52 51 50 49 48 43 100 - 16 ATF1508ASV(L) ATF1508ASV(L) ATF1508ASV(L) I/O Pinouts (Continued) MC 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 PLB E/ PD2 E E E E E E E E E E E E E F F F F F F F F F F F F F F F F/ TCK 84-lead J-lead 45 46 48 49 50 51 52 54 55 56 57 58 60 61 62 100-lead PQFP 43 44 46 47 48 49 50 51 52 54 55 56 57 58 59 60 62 63 64 100-lead TQFP 41 42 44 45 46 47 48 49 50 52 53 54 55 56 57 58 60 61 62 160-lead PQFP 63 64 65 67 68 69 70 71 72 73 78 80 88 89 90 91 92 93 94 96 97 98 99 MC 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 PLB G G G G G G G G G G G G G G/ TDO H H H H H H H H H H H H H H H H/ GCLK3 84-lead J-lead 64 65 67 68 69 70 71 73 74 75 76 77 79 80 81 100-lead PQFP 66 67 69 70 71 72 73 74 75 77 78 79 80 81 82 83 85 86 87 100-lead TQFP 64 65 67 68 69 70 71 72 73 75 76 77 78 79 80 81 83 84 85 160-lead PQFP 101 102 103 105 106 107 108 109 110 111 112 121 122 123 128 129 130 131 132 134 135 136 137 17 SUPPLY CURRENT VS. SUPPLY VOLTAGE (T A = 25C, F = 0) 200 800 SUPPLY CURRENT VS. SUPPLY VOLTAGE PIN-CONTROLLED POWER-DOWN MODE (T A = 25C, F = 0) STANDARD POWER 700 STANDARD & REDUCED POWER MODE ICC (mA) 100 REDUCED POWER ICC (uA) 600 500 0 2.50 2.75 3.00 3.25 3.50 3.75 4.00 SUPPLY VOLTAGE (V) 400 2.50 2.75 3.00 3.25 3.50 SUPPLY VOLTAGE (V) 3.75 4.00 SUPPLY CURRENT VS. FREQUENCY STANDARD POWER (TA = 25C) 250.0 SUPPLY CURRENT VS. FREQUENCY LOW-POWER ("L") VERSION (TA = 25C) 125.0 STANDARD POWER 200.0 STANDARD POWER 100.0 ICC (mA) ICC (mA) 150.0 75.0 REDUCED POWER 50.0 100.0 REDUCED POWER MODE 50.0 25.0 0.0 0.0 0.00 0.00 20.00 40.00 60.00 80.00 100.00 FREQUENCY (MHz) 5.00 10.00 FREQUENCY (MHz) 15.00 20.00 SUPPLY CURRENT VS. SUPPLY VOLTAGE LOW POWER ("L") MODE (T A = 25C, F = 0) 10 9 8 7 ICC (uA) 6 5 4 3 2 1 0 2.50 2.75 3.00 3.25 3.50 SUPPLY VOLTAGE (V) 3.75 4.00 18 ATF1508ASV(L) ATF1508ASV(L) OUTPUT SOURCE CURRENT VS. SUPPLY VOLTAGE (V OH = 2.4V, T A = 25C) 0 -2 -4 OUTPUT SOURCE CURRENT VS. OUTPUT VOLTAGE (VCC = 3.3V,T A = 25C) 10 0 -10 IOH (mA) -20 -30 -40 -50 -60 -70 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 IOH (mA) -6 -8 -10 -12 -14 -16 2.75 3.00 3.25 3.50 3.75 4.00 SUPPLY VOLT AGE (V) OUTPUT VOLTAGE (V) OUTPUT SINK CURRENT VS. SUPPLY VOLTAGE (VOL = 0.5V, T A = 25C) 40 100 80 OUTPUT SINK CURRENT VS. OUTPUT VOLTAGE (VCC = 3.3V, T A = 25C) 35 IOL (mA) IOL (mA) 60 40 20 0 30 25 20 2.75 3.00 3.25 3.50 3.75 4.00 0 0.5 1 1.5 2 2.5 3 3.5 4 SUPPLY VOLTAGE (V) OUTPUT VOLTAGE (V) INPUT CLAMP CURRENT VS. INPUT VOLTAGE (VCC = 3.3V, TA = 25C) 0 -20 -40 -60 -80 -100 -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 INPUT VOLTAGE (V) INPUT CURRENT (uA) INPUT CURRENT vs. INPUT VOLTAGE (VCC = 3.3V, TA = 25C) 15 10 5 0 -5 -10 0 0.5 1 1.5 2 2.5 3 3.5 INPUT VOLTAGE (V) INPUT CURRENT (mA) 19 ATF1508ASV(L) Ordering Information tPD (ns) 15 tCO1 (ns) 8 fMAX (MHz) 100 Ordering Code ATF1508ASV-15 JC84 ATF1508ASV-15 QC100 ATF1508ASV-15 AC100 ATF1508ASV-15 QC160 ATF1508ASV-15 JI84 ATF1508ASV-15 QI100 ATF1508ASV-15 AI100 ATF1508ASV-15 QI160 ATF1508ASVL-20 JC84 ATF1508ASVL-20 QC100 ATF1508ASVL-20 AC100 ATF1508ASVL-20 QC160 ATF1508ASVL-20 JI84 ATF1508ASVL-20 QI100 ATF1508ASVL-20 AI100 ATF1508ASVL-20 QI160 Package 84J 100Q 100A 160Q 84J 100Q 100A 160Q 84J 100Q 100A 160Q 84J 100Q 100A 160Q Operation Range Commercial (0C to 70C) 8 100 Industrial (-40C to +85C) 20 12 83.3 Commercial (0C to 70C) 12 83.3 Industrial (-40C to +85C) Using "C" Product for Industrial There is very little risk in using "C" devices for industrial applications because the VCC conditions for 3.3V products are the same for commercial and industrial (there is only 15C difference at the high end of the temperature range). To use commercial product for industrial temperature ranges, de-rate ICC by 15%. Package Type 84J 100Q 100A 160Q 84-lead, Plastic J-leaded Chip Carrier (PLCC) 100-lead, Plastic Quad Pin Flat Package (PQFP) 100-lead, Very Thin Plastic Gull Wing Quad Flat Package (TQFP) 160-lead, Plastic Quad Pin Flat Package (PQFP) 20 ATF1508ASV(L) ATF1508ASV(L) Packaging Information 84J, 84-lead, Plastic J-leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AF 100Q, 100-lead, Plastic Gull Wing Quad Flat Package (PQFP) Dimensions in Millimeters and (Inches) PIN 1 ID 17.44 (0.687) 16.95 (0.667) 0.65 (0.026) BSC 0.41 (0.016) 0.22 (0.009) 20.12 (.792) 19.87 (.782) 23.45 (0.923) 22.95 (0.904) 0.25 (0.010) 0.10 (0.004) 7 0 14.12 (0.556) 13.87 (0.546) 3.40 (.134) MAX 1.03 (0.041) 0.73 (0.028) 0.10 (0.004) MIN *Controlling dimension: Millimeters 100A, 100-lead, Very Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) Dimensions in Millimeters and (Inches)* 160Q, 160-lead, Plastic Gull Wing Quad Flat Package (PQFP) Dimensions in Millimeters and (Inches) 16.25(0.640) 15.75(0.620) PIN 1 ID 0.27(0.011) 0.17(0.007) PIN 1 ID 1.238(31.45) SQ 1.218(30.95) .016(0.40) .008(0.20) .0256(0.65) BSC 0.56(0.022) 0.44(0.018) 14.10(0.555) 13.90(0.547) 0.20(0.008) 0.10(0.004) 0-7 0.75(0.030) 0.45(0.018) 0.15(0.006) 0.05(0.002) 1.05(0.041) 0.95(0.037) 1.106(28.10) .009(0.23) .004(0.10) .037(0.95) .025(0.65) 7 0 1.098(27.90) SQ .157(3.97) .127(3.22) .020(0.50) .002(0.05) *Controlling dimension: Millimeters *Controlling dimension: Millimeters 21 Atmel Headquarters Corporate Headquarters 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Atmel Operations Atmel Colorado Springs 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759 Europe Atmel SarL Route des Arsenaux 41 Casa Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Atmel Rousset Zone Industrielle 13106 Rousset Cedex France TEL (33) 4-4253-6000 FAX (33) 4-4253-6001 Atmel Smart Card ICs Scottish Enterprise Technology Park East Kilbride, Scotland G75 0QR TEL (44) 1355-803-000 FAX (44) 1355-242-743 Asia Atmel Asia, Ltd. Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimhatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 Atmel Grenoble Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex France TEL (33) 4-7658-3000 FAX (33) 4-7658-3480 Japan Atmel Japan K.K. 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 Fax-on-Demand North America: 1-(800) 292-8635 International: 1-(408) 441-0732 literature@atmel.com Web Site http://www.atmel.com BBS 1-(408) 436-4309 (c) Atmel Corporation 2000. Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Atmel's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel's products are not authorized for use as critical components in life suppor t devices or systems. Marks bearing (R) and/or TM are registered trademarks and trademarks of Atmel Corporation. Printed on recycled paper. 1408E-09/00/xM Terms and product names in this document may be trademarks of others. |
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